
Board
Quantities
CircuitExpress,
Circuit Express, Printed Circuit Boards, Off-Shore
Printed Circuit Boards, Off-Shore Manufacturing,
Printed Circuit Board Fabricators, Printed Circuit
Board Representatives, Assembly, Rigid-Flex/
Flex/ Flexible, Global manufacturing, Electronic
Manufacturing, OEM, Prototype, Printed Wire,
Boards, Semi-conductor, High-Volume Production,
Surface Mount, Turn-key, Quick turnaround, Double
sided, Multi-layer, Cable harness, Drill and
Router accessories, Ceramic, Metal-core Gerber,
Cad/cam, SMT Solder Paste Stencils, Electronic
equipment
Prototype
and high production quantities
Scheduled low and high volume production for
J.I.T.
Approvals
CircuitExpress,
Circuit Express, Printed Circuit Boards, Off-Shore
Printed Circuit Boards, Off-Shore Manufacturing,
Printed Circuit Board Fabricators, Printed Circuit
Board Representatives, Assembly, Rigid-Flex/
Flex/ Flexible, Global manufacturing, Electronic
Manufacturing, OEM, Prototype, Printed Wire,
Boards, Semi-conductor, High-Volume Production,
Surface Mount, Turn-key, Quick turnaround, Double
sided, Multi-layer, Cable harness, Drill and
Router accessories, Ceramic, Metal-core Gerber,
Cad/cam, SMT Solder Paste Stencils, Electronic
equipment
CircuitExpress,
Circuit Express, Printed Circuit Boards, Off-Shore
Printed Circuit Boards, Off-Shore Manufacturing,
Printed Circuit Board Fabricators, Printed Circuit
Board Representatives, Assembly, Rigid-Flex/
Flex/ Flexible, Global manufacturing, Electronic
Manufacturing, OEM, Prototype, Printed Wire,
Boards, Semi-conductor, High-Volume Production,
Surface Mount, Turn-key, Quick turnaround, Double
sided, Multi-layer, Cable harness, Drill and
Router accessories, Ceramic, Metal-core Gerber,
Cad/cam, SMT Solder Paste Stencils, Electronic
equipment
Commercial
manufactured to IPC standards.
UL 94V-0, Code 2, No. E92841. (to .004"
min. lines).
Military, MIL-P 55110
GF, GI, CE Type 1, 2 and 3 with etchback.
NASA NHB5300.4 requirements for printed wiring
boards.
MIL-I-45208 Quality System.
ISO 9001:2000 Cert.# 04-R0208
Materials
All
Laminates and Prepreg certified per MIL-S-13949
FR4 GF (including Tetrafunctional and Multifunctional)
BT/Epoxy laminates
Polyimide GI
Teflon
HTE copper
Heatsinks/Bonding
Alclad
Aramid
Kapton
Ceramic
Multilayer
24
plus layers, average layer count 10-14 layers.
Fine line to .004" & thin core, utilizing
vacuum press
lamination 24 x 24 platens Multiline post-etch
punch
tooling system Controlled impedance.
In-house engineering support for design and
TDR
verification Access to Gerber Automated Optical
Inspection ATE for shorts and opens
Drilling
Top
Process
standard hole diameters of 6:1 aspect ratio
Smaller hole diameters of more than 4:1 aspect
ratio
Blind and buried via capability
Surface
Finishes
Tin/Lead
plate with infra-red reflow
Tin-Nickel Nickel-Gold tab and full panel
Silver Palladium White Tin
Electroless Ni-Immersion Gold
Solder Mask Over Bare Copper (SMOBC),
with Hot Air Solder Level (HASL)
Selective Solder Strip
Circuit
Traces & Spacings
Fine
Line technology to .004".
Fine Pitch Surface Mount Technology (SMT).
Solder
Mask & Legend
Liquid
Photoimageable Soldermask.
Dry Film Soldermask.
Standard screen epoxy masks.
Silkscreen Nomenclature standard epoxy.
Electrical
Testing
Circuit-Line
100 Volt Universal Grid Test System.
Test area of 16.0" X 22.0" in. with
35,000 test points.
Clamshell testing with SMT. Net list testing
from
Gerber Data. High voltage testing.
Laboratory
Process Control
Fully compliant and automated Waste Treatment
System.
Plating analysis capabilities and full service
in-house lab for
cross-sections, elongation and tensile strength
of plated
deposits, microscopic examinations
Cam/Photoplotting
Gerber
conversion with laser photoplots Complete
Computer Aided Manufacturing with panelization
High Speed dedicated Modem Download Internet
access via www page, e-mail, and Ftp site (coming
soon).
Scoring/Web
Routing
Per Spec
Dry
Film Soldermask Top
Riston and Dynachem